YMTC has its X3-9070 PCIe 4.0 type unit with 232-layer 3D NAND in production

Ymtc Has Its X3-9070 Pcie 4.0 Type Unit With 232-Layer 3D Nand In Production
Ymtc Has Its X3-9070 Pcie 4.0 Type Unit With 232-Layer 3D Nand In Production

YMTC continues to make headlines throughout the NAND reminiscence world as it’s the Chinese producer that first introduced its chips. 232-layer 3D NAND, the X3-9070 chips of Xtacking 3.0 structure. Although Micron was forward of it by presenting the primary collection with this type of chip, YMTC has now indicated that it has a collection in production that additionally integrates them. is the Zhitai TiPlus 7100 collectionwhich has a PCIe 4.0 ×4 connection.

This collection will likely be accessible in M.2 2280 format and with capacities of 512 GB, 1 TB and a pair of TB, with speeds of as much as 7000/6000 MB/s sequential learn/write and as much as 900/700 kIOPS random learn/write . They are fairly excessive speeds, though we must wait to see the true random efficiency because it lacks DRAM as a buffer, as an alternative making a buffer in the principle system reminiscence (HMB) as a lot of these items do.

Durability tops out at 1,200TB on the highest-capacity mannequin, and the corporate gives a five-year restricted guarantee. At the second it may be bought in China, and we’ll see if it reaches the West by way of Chinese gross sales shops.

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