Within the manufacturing of chips right now, encapsulation strategies are simply as essential because the manufacturing of the chips themselves. It is a broad and complicated area that encompasses from the substrate to which the chips are soldered to the way in which of stacking numerous chips interconnecting them, or the communication between numerous chiplets inside the bundle, amongst different facets. Samsung is aware of that it’s behind TSMC, and due to this fact doesn’t miss the chance to recruit its employees. In this case, a former firm executive, Lin Jun-Cheng.
This engineer has greater than 450 firm patents to his credit score, virtually all associated to chip encapsulation. He has been working for the corporate for nineteen years, which is why he has additionally lived by your complete transition that the sector has skilled in recent times. In different phrases, he has a broad imaginative and prescient of the sector on this area and numerous expertise, which is what Samsung is wanting for.
Lin Jun-Cheng left his function as R&D director at TSMC in 2017 to behave as CEO of Skytech, a Taiwanese lithographic equipment firm. He now joins Samsung as vice chairman of the Advanced Encapsulation enterprise unit. It is at the least an attention-grabbing motion on the a part of Samsung, and one which had higher come to fruition quickly as a result of the current of the chips are already multichip modules, and on this they’ve every thing to do with these superior packaging strategies.